НАУЧНО-ИССЛЕДОВАТЕЛЬСКАЯ РАБОТА В SAMSUNG ELECTRONICS

Мировой лидер в области высоких технологий - Samsung Electronics проводит в середине апреля 2007 года ЯРМАРКУ ВАКАНСИЙ (Samsung Job Fair 2007), на которую приглашаются технические специалисты, заинтересованные в научно-исследовательской работе в исследовательских центрах компании

Особый интерес представляют специалисты следующих направлений:
 Разработка программного обеспечения, программных продуктов, алгоритмов, математических моделей (Linux, Linux Kernel, Java, XML, BIOS, MAC, MPLS, RTOS, Windows, VxWorks, pSOS, SQA, OCAP, MHP, DASE, Algorithms)
 Создание систем управления, кибернетических систем, систем со встроенным программным обеспечением (Embedded Linux, UNIX, Embedded Windows, Java, MPEG, JPEG, UWB, H.264, DSP, Audio / Video Codec, Image / Video Processing, Multimedia, QA)
 Разработка новых систем, приборов и устройств на основе дисплейных технологий, электроники, радиотехники (TRIZ, ASIC, SoC, FPGA, Verilog, OFDM, MIMO, WLAN, WiMAX, WiBRO, MEMS, CRT, LCD, OLED, PDP, EEFL, CCFL)
 Проведение научно-исследовательских работ в области прикладной математики, физики, оптики, химии (Software, Middleware, Hardware, GPRS, UMTS, RF IC, CDMA 2000, Smart Antenna, TCP / IP, VoIP, Bluetooth, System LSI, Servo Control, Semiconductors, TFT, DRAM, SRAM, FRAM, PRAM, WBI, PCB, Optics)

Требования к кандидатам:
 Образование: высшее в области техники, математики, физики или химии (бакалавр, специалист, магистр, кандидат / доктор наук); также приглашаются студенты последних курсов и аспиранты
 Английский язык: выше среднего
 Средний балл: выше 4,0

Преимущества работы в Samsung Electronics:
 Крупная международная компания
 Высокая 'белая' зарплата
 Официальный трудовой договор
 Возможность карьерного роста
 Полный социальный пакет

Для подачи заявки необходимо составить на английском языке развернутое резюме (личные данные, образование, опыт работы) и направить его до 1 апреля 2007 года по адресу: Jobfair@samsung.ru (окончательный срок приема резюме: 10 апреля 2007 года).

Более подробная информация и подача заявки: http://JOB.samsung.ru

Research and Development Work at SAMSUNG ELECTRONICS

The world leader in the area of high technologies Samsung Electronics is holding Samsung Job Fair 2007 in mid April 2007. The job fair will present over 100 vacancies for software developers, mathematicians, algorithm designers, RnD engineers, physicists, and chemists interested in RnD Centers of the company.

Particular interest is shown in the following specialists:
 Software development, application package development, algorithm design, and mathematical model simulation (Applied Mathematics, Computer Science, Algorithms, Linux, Linux Kernel, Java, XML, BIOS, MAC, MPLS, RTOS, Windows, VxWorks, pSOS, SQA, OCAP, MHP, DASE)
 Control system development, cybernetic system development, embedded-softeware system development (Embedded Software, Multimedia, Embedded Linux, UNIX, Embedded Windows, Java, MPEG, JPEG, UWB, H.264, DSP, Audio / Video Codec, Image / Video Processing, QA)
 Development of novel systems, devices, and equipment on the basis of display technologies, electronics, and radio engineering (Theory of Solving Inventive Problems [TRIZ], ASIC, System on Chip Design [SoC], FPGA, Verilog, OFDM, MIMO Modem, Wireless LAN, WiMAX, WiBRO, MEMS, CRT, Liquid Crystal Display [LCD], Organic Light Emitting Diodes [OLED], Plasma Display Panels [PDP], EEFL, CCFL)
 Research and development work in the areas of applied mathematics, physics, optics, and chemistry (Software, Middleware, Firmware, Hardware, GPRS, UMTS, RF IC, CDMA 2000, Smart Antenna, TCP / IP, VoIP, Bluetooth, System LSI, Servo Control, Semiconductor, TFT, DRAM, SRAM, FRAM, PRAM, WBI, PCB, Optics)

Requirements for Candidates:
 Higher education in mathematics, engineering, physics, chemistry (such as B.Sc., M.Sc., Ph.D., or Dr.Sc.)
 English language: Good Skills
 GPA: Above Good and Above

Advantages of Work at Samsung Electronics:
 Large International Company
 High Salary
 Official Employment Agreement
 Career Opportunities
 Social Package

To apply, please, send us your complete CV in English at Jobfair@samsung.ru by 1 April 2007.

More detailed information is available here: http://JOB.samsung.ru


Corporate Technology Center: Required Majors
Electrical Engineering
Computer Science
Applied Mathematics
Mechanical Engineering
Cybernetics
Industrial Engineering
TRIZ
AREA JOB SPECIFICATION
Embedded OS Real-Time Operational Systems (WinCE, VxWorks, Embedded Linux, EPOC, and REX)
Graphic Systems
Multimedia CODEC
File System Development
Flash Memory Control
Bit-Serial Processing
System Architecture Development
Device Drivers
Application for Embedded Systems Browser and Messaging Development (E-mail, P2P), PIMS, XML, PVR, EPG
Thin Client Development
Multimedia Player and E-Commerce
User Interface Development
Remote Control
Human Computer Interface
Recognition
Software Engineering Software Quality Assurance
Software Development
Project Management Development Methodology
Software Patterning
Development Innovation and IT Infrastructures Collaborative Product Commerce
Information System Architecture
Product Data Management Systems
Automatic Control of Projects, Processes, and Document Circulation
CAD/CAE Solutions Virtual Prototyping (Mechanical-Electrical and Multi-Domain Simulation)
Electronic Design Automation (EDA) (such as Application Software, Signal Integrity, Radio-Frequency Analysis, Electromagnetic Compatibility, Hardware/Software Co-Simulation, Specific Absorption Rate)
Mechanical Design Automation (MDA) (such as Design Automation Software, Knowledge-Based Design, CAD Data Interface, Digital Mock-Up, 3D Application)
Mechanical Computer-Aided Engineering (MCAE) (such as Thermal and Fluid Analysis, Optical Analysis, Structural Analysis, Vibration and Acoustics, Optimal Design, Injection Molding, Dynamics, etc.)
Innovative Methodology Theory of Solving Inventive Problems (TRIZ)
Design for Service
Data Fixed Exchange
Reusable System Development,
Value Engineering and Value Innovation

Telecommunication Network Business: Required Majors
Electronics Engineering
Communications Engineering
Automation and Control
Radio Technologies and Telecommunications
Radio Electronics, Antenna Design, Computer Science
Mechanical Engineering
Physics
Chemistry
Materials Science
AREA JOB SPECIFICATION
Mobile Communication Division Hardware Development: CDMA2000 1x EV-DO/DV, GPRS, UMTS, Global Positioning systems (GPS), Radio-Frequency Integrated Circuits (RFIC), Applications Specific Integrated Circuits (ASIC), Radio Technologies, Digital signal Processing (DSP), Antenna and Radiation Technologies, Transmitter Power Control, Sensitivity and Intermodulation Distortion (IMD), Phase-Locked Loop (PLL) Synthesizers, RSSI Control, Radio-Frequency Pattern Matching, Electromagnetic Interference (EMI) Shield, Low-Current Technologies, DC Power Control, Modem Interface, Audio (CODEC Control), Display and Video Control, Acoustic Control and Audio System Integration, Data Processing, GPRS, and UMTS
Device Development: New Technology Development, New Method Development, Thin-Film Molding Technology, Thin-Shape / Light / High Strength Metallic Material Application Technology, and High-Speed Cycle Injection Technology
Software Development: Application, User Interface (Ul), Operational Systems (OS), C++, Java, Browser, Game Development, Voice Recognition, Bluetooth, and Ir-DA Security
Telecommunication Systems Division Wireless System: Radio Access (CDMA2000 1x EV-DV, Smart Antenna, Mobile IP, System Reliability Analysis, CDMA/W-CDMA Modem, SDR, Air System Design, Air Interface Specification), Core Networks (IP-Based System Architectures, M-G/W, Software Switches (Softswitches), Hand-Off and Hand-Actuated Switches, IP Security and IP Switches)
Wireline System: Back Bone (System Architecture Design, Routing Software, IP Multicast, IP Quality of Service [IP QoS], IP Traffic Engineering); Digital Subscriber Transportation (SOFTWARE Architecture, IP NETWORK QoS Process Scheme, VoDSL / VoIP Process Schemes, and System ASIC Design)
Home Office Network: Home Network (Home G/W, Home Server, IAD, Security, Firewall Software, VoIP Software, Bluetooth, and Power Saving), Office NETWORK (UWB, WLAN, OoS, MPLS, Routing Software, IPv6, Security, MAC, OOD/OOA, and Embedded Linux)
Telecommunication R&D Center Next Generation Terminal and System Development: Signal Processing, Orthogonal Frequency Division Multiplexing (OFDM) Modem, OFDM-MIMO, Multiuser Diversity, Turbo /Space Time Code, JAVA Expert, C++, CAMEL, RANAP Signaling, G-MAP, AAL2, Smart/Broadband Antenna, and Circuit Design
Terminal Modem Development: CDMA2000 / UMTS Algorithm, CDMA2000 / UMTS Layer 1 Software, Channel Codec Algorithm (Turbo, Vitabi), ASIC Design, Digital Telecommunications, GPS, Bluetooth / Home Radio-Frequency Systems, and SOFTWARE Applications (IP Protocols)
IP Network, Home Network, and Optical Telecommunication Development: Optical Transmission, Optical Amplifier (EDFA, Raman), Transponder, Optical Network, QoS Network Simulation and Dimensioning, TCP/IP-Based Mobility, and IPv6
Standardization: AII IP RAN/CN Evolution and Harmonization, IPv6-Based Mobile IP Router Testbed, OFDM Modem, OFDM-MIMO, Wireless MAC, Mutiuser Diversity, Telecommunication and Signal Processing, Air Interface, Channel Codec, Multimedia Broadcasting Standards, Uplink Enhancement, WLAN Interworking, and 1xEV-DV RL Enhancement
WiBro (Wireless Broadband) Wireless System: Radio Access (CDMA2000 1x EV-DV, Smart Antenna, Mobile IP, System Reliability Analysis, CDMA/W-CDMA Modem, SDR, Air System Design, Air Interface Specification), Core Networks (IP-Based System Architectures, M-G/W, Software Switches (Softswitches), Hand-Off and Hand-Actuated Switches, IP Security and IP Switches)


Digital Media Business: Required Majors

Electronics Engineering
Computer Science
Applied Mathematics
Telecommunication Networks
Wireless Technologies
Cybernetics Mechanical Engineering
Material Science
Acoustics
Optics Engineering
Optics Design
AREA JOB SPECIFICATION
Visual
Display
Division Electrical Engineering:
Digital TV/Monitor System Design (DLP, LCD, PDP, and new display panel including OLED and FED).
Hardware/Software/Multimedia Platform Design for the DTV, Digital Multimedia Broadcasting (DMB), and Home/Mobile Application Devices.
Home Network System Design with Channel and RF/Antenna.
Multimedia Processing & Architecture Design, SoC Design (CPU, DSP, and Bus/Memory System), and ASIC Design using the Verilog/VHDL in Xilinx and Cadence Design Flow.
Algorithm Development for High-Quality Image Processing with Image Enhancement, Resolution Enhancement, Format Conversion, and Color Processing.
Digital/Analog RF Circuit Design, Analog Circuit Design for Nonlinear Systems, Power Module Design for New Display Light Sources, System Simulation and Analysis, as well as EMC/EMI.
Computer Science & Engineering:
System Software Design including Embedded OS (Windows XP, Vista) and Device Driver Development.
Middleware Design for DTV Middleware, Security, and Java VM.
Multiprocessor-Based Software Platform Design using the CPU and Data Engine.
Home Network System Design with Application, Network Protocol, and Network Interface Software.
Multimedia Processing using the AV Codec and Digital Right Management with Copy Protection, Security.
Graphic Engine and Window System Design and Input Device/UI Design for the Next-Generation Device Control and Communication.
Software Engineering for the Software Process, SPICE, and SQA.
Video Signal Processing (Image and Graphics, Video Post- and Pre-Processing), and Audio Post-Processing
Embedded Operating Systems (LINUX, Windows XP, Vista, WinCE, etc.), Device Drivers, Firmware, Interactive Middleware (DASE, OCAP)
Mechanical Engineering & Optics:
Mechanical Design for DTV Components: Structural Analysis and Design for DTV System, Thermal Analysis and Design for Cooling System, as well as Noise Analysis and Design for DTV Cooling Fan.
Mechatronics Research, Material Science, Manufacturing, and Productivity for Display Devices.
New Display Analysis and Design: 3D Display, Display Application for LED Source, Laser Source, FED, and Micro-Display, HOE/DOE for Display Application.
Optics Engineering and System Design: Illumination System, Projection Optical System, and General Geometric Optics.
Computer
and
Internet
Systems Home Network (Home RF, PNA, PLC, xDSL, uPnP, 1394, UWB), 3GIO, Serial ATA, MPEG Embedded OS (LINUX, Windows XP, Vista), as well as Server and Network Management Software
Personal Digital Assistant (PDA), Tablet PC Solution, W-LAN (Hardware and Software), 802.11x, CDMA/GPRS, Radio Frequency Systems, Bluetooth GPS Applications, Antenna, and Digital/Analog Circuit Architectures
Device Driver Application Software, Driver Development, CPU Bus Architecture, System Control, BIOS and User Interface, Java and XML, Security, WMA, Stream Data, Power Management, Windows File System Development, WinCE Porting and Drivers, DC/DC and AC/DC Logic Design, EMI / Shielding and Signal Integrity HCI Solution (Voice / Finger / Pen Recognition), 3D Architecture Design (Pro-E), Thermal Solution, and Vibration/Noise
Technical Planning and Technical Writing
Digital Video Systems
DVD Player, DVD COMBO, Digital Camcorder, SET TOP BOX, Wireless Security, Camera-Related Hardware, Software, etc.
Software: Application Software, Embedded Software, LINUX, Windows XP, Vista and WinCE
Hardware: Digital Circuit Architecture, MPEG, JPEG, and H.264
Audio: High-Quality Speaker Design
Other Fields: DVD Optical Pickup, and CAM Camera Lens Design
Digital
Printing Software: Device Driver (PCL, PDL, MAC, and LINUX), Driver Development, Embedded Software (System Design), Operating System (Windows XP, Vista, VxWorks, pSOS, etc.), Windows XP System Software, Image Processing (Half-Toning, Image Rendering, Color Matching, Image Resolution Enhancement), Software Architecture Design, Network Protocol (Wireless LAN Protocol), Software Engineering, Programming Techniques, Software Test Methodology, and SQA
Hardware: Engine/Sequence Control, Digital / Analog Circuit Design, ASIC (SoC) Design, Embedded Controlled System Design, Computer Architecture, EMC / EMI & Signal Integrity, Power Management, Parts Stress Analysis, Automatic Control Systems (Mechatronics and Control Algorithms), as well as Printing Quality Assessment and Improvement
Mechanism: Driving Mechanism and Control (Paper Path, Motion Quality), Vibration and Noise Analysis, Heat Transfer and Fluid Flow, Virtual Prototype Simulation, Mechatronics, MEMS, and Parts Stress Analysis
Electro-Photography: Electrostatics (Process Modeling and Mechanic Design), Optics System Design, Opto-Mechanical Design, and Toner Rheology
Material Synthesis: Ink (Dye / Pigment Ink), Toner (Dry / Liquid Toner), Polymer Synthesis (Emulsion, Suspension, Solution, Dispersion), Imaging Materials Synthesis (Electron/Hole Transport Materials, Charge Generation Materials, and Pigment / Dye Surface Treatment), Surface / lnterfacial Science, and Coating Science
R&D
Center Software: Embedded LINUX, Windows XP, Vista, WinCE, Java, DTV Middleware, and Software Architectures
Network: Wireless LAN, Radio-Frequency Systems, Antennas, Wireless Security, QoS, A/V Streaming, and UWE
Mobile: Protocol Stack, Mobile IP, Video CODEC (H.264 and MPEG-4), and Architecture
DTV: Signal Processing (MPEG-2, MPEG-4,JPEG, and H.264), System Architecture, and Channel Coding
Display: Optical Architecture and Image / Video Processing
Storage: Channel Coding, ASIC / SoC, Servo Control, Radio-Frequency Systems, and AV Digital Signal Processing (DSP)
Audio: Audio DSP Software, Audio DSP Hardware, and Audio Architecture
Security: Code Theory and Conditional Access Systems
Digital Video Systems Home Theater System Development with High-Power Sound (over 600 W) and Matching Wide-Screen TV
Vertical-Type Home Theater System Development, Vertical & Tallboy-Type Home Theater System Development with Rear Speakers
Rear Reflecting Surround Systems
Wireless Home Theater Systems (WHTS)
Development of Flash-Type MP3 Players, USB-Type MP3 Players, HDD-Type MP3 Players
MP3 / WMA / WAV System Development
Portable Media Players (PMP) Development: Divx, MPEG4, WMV, MJPEG, File Playback
Portable Media Center (PMC) Development: Microsoft PMC OS Platform, WMV File Playback
3.5" TFT LCD Development
Development of Multimedia DRM-Cable TVs
Development of DVD, VCD, CD, MP3 CD Players, CD-R/RW
Voice Recording Systems
Built-in FM Transmitters
Optics Design

Semiconductor Business: Required Majors
Electronics Engineering
System-on-Chip Design
Physics
Materials Science
Chemistry
Computer Science
AREA JOB SPECIFICATION
System LSI System-on-Chip (SOC) Design Methodology, Audio-Visual Algorithms, DTV/STB Systems, Resistor-Transistor-Logic (RTL) Coding
Device Drivers, API, Linux, pSOS, VxWorks, Middleware Graphics HARDWARE Acceleration, and Application Programming Interface Design
CPU/OS Architectures, Microprocessor/DSP Architectures, Radio-Frequency Integrated Circuits (RFIC), and Transceivers
Active and Passive Devices, Complementary Metal-Oxide Semiconductors (CMOS), Bipolar Complementary Metal-Oxide Semiconductors (BiCMOS), Orthogonal Frequency Division Multiplexing (OFDM) PHY BBP or DSSS PHY BBP, IEEE 802.11x MAC
ARM-Processor-Based Design, MAC/PHY Interface, Embedded CPU Processors, Digital Communication System-on-Chip (SOC) Design
Digital Video Disks (DVD), Digital Video Recording (DVR), MPEG2/4, Video Signal Processing, ARM/Calm Processors, Digital Signal Processing (DSP) Algorithms, Adaptive Differential Pulse-Code Modulation (ADPCM)
Automatic Control Systems, Complementary Metal-Oxide Semiconductor (CMOS) Devices, SpecC, HARDWARE Design and Verification for Media Player Processor Design
High Speed/Low Power Design, Mixed Signal Circuitry, Analog-to-Digital Converters (ADC), Digital-to-Analog Converters (DAC), CODEC, Phase-Locked Loop (PLL), ARM Embedded SOC
Mobile Chip Sets, Networks, Media (CD-ROM, DVD, and LCD Monitors)
Liquid-Crystal Display Driver Interface (LCD DDI), CCD, Card Information Systems (CIS), Smart Cards, FCC-Standard-Based Systems, and Multipoint Control Units (MCU)
Capacitors, Shallow Junctions, Low-Temperature Dielectrics, High-k/SON, Epitaxial Growth, Micro-Electro-Mechanical Systems (MEMS)
SONOS, Salicide, Thin Film, Image Sensor/RF/Module Design, Cooling Design, and Thermal Simulation
Electrostatic Discharge (ESD) and Electromagnetic Interference (EMI) Latch-ups, Wafer-Level Processes, Bumping, and Encapsulation
Memory Division Memory Design for DRAM (DDR, RDD, Graphic DRAM, Mobile DRAM), SRAM (Low Power SRAM, High Speed SRAM), Flash (NAND/NOR), and New Memory (FRAM, PRAM) Design, System Design, and Module Design (PCB)
Semiconductor Process: Lithography, Etching, Diffusion, Thin Film, Control Microprocessors, MASK, Cleaning, Ion Implantation, Chemical Vapor Deposition (CVD), Device Isolation, Transistor, Capacitor, Dielectric, and Metallization
Device Modeling and Simulation, Circuit Modeling, Device Physics, Quality Assurance, Quality Control, and Process Architecture
Packaging Technology and Device Test
OMS Division System Control Design and Hardware (Optical Pickup and Mechanical Control, Circuit Design, Firmware, EMI / EMC, Optical Disk Drive Development, and Firmware Design for Interfacing Computers)
Optical Pickup Design Technology (Optical / Lens System Design, Actuator, and Component Technology)
Optical Deck Mechanism Technology (Loading / Feeding Systems, Vibration / Noise Analysis, and Small Spindle / Sled Motor Development)
Storage Division 3.5" HDD for Desktop Personal Computers
Digital Video Recorders (DVR)
Portable Video Recorders (PVR), such as MP3 Players
2.5" HDD for Notebooks and Personal Computers
Mobile Applications
Device Packaging Center Device Assembly, Quality Testing, Reliability Technologies
Module Surface Mounting, and Module / Card / Material Process Technologies
Module / Card / Material Testing, Equipment Technologies

Liquid Crystal Display Business: Required Majors
Electronics Engineering
System-on-Chip Design
Physics
Materials Science
Chemistry
Computer Science
AREA JOB SPECIFICATION
Device Technology Development Note PC, Monitor, LCD-TV, Mobile Display LCD Panel, Transmission-Type / Reflective-Type LCD Panel, High-Transparent Organization, Light Recycling Organization, System Integration Technology, Device Test, Process Architecture
Design Technology (Color, Driver Circuit, Light Source, CAE): TFT/CF Circuit, Backlight Design, Mechanism Design, SMPS Power LCD Driving Circuit, Low-consumption Low-Electric Power Driving Circuit Design, Timing Controller, Interface Circuit, Backlight, CCFL, EEFL, Fluorescent Lamp, LED, CNT FED B/L, Inverter, Optical Film, Device Simulation, Optical Simulation, Device/Element Analysis, CAD SW
Process Development TFT/CF Process, LTPS Process, LC Mode/Process, Material Development: Photo Lithography, CVD, Sputter, Wet/Clean, Dry Etching, Photo Resist, Organic Insulator, Stripper, Etchant, Electronics Materials, Low-Temperature Poly Silicon Crystallization, Eximer Laser Anneal (ELA), Sequential Lateral Solidification (SLS), Metal Induced Lateral Crystallization (MILC), Liquid Crystal, Low-Tension/High-Speed Liquid Crystal Material, Liquid Crystal Mode, Alignment Layer, Rubbing, LC Alignment Adhesives, Anisotropic Conductive Film, OLB, SMT, Printed Circuit, Chip on Glass, Pb-Free Compounds, etc.
Display Development Flexible Display Organic EL Technology: Organic TFT, OLED, PLED, New Display Mode, E-Ink, Evaporation, Ink Jet Printing, Roll-to-Roll Process, Low-Temperature High Tension Process Technology, Encapsulation Technology
Software System SW, Application SW: Firmware - MCU Control SW, Interface Technology IEEE1394, USB, Device Driver Technology (Languages: C, C++, MFC, VB, Java, Win32, Assembler)
System Digital Circuit, Analog Circuit, DSP, ASIC (SOC)
ASIC Optimization
PCB Board Design, High-Speed Data Transmission Technology, Feedback Circuit Design, Conductive Splice Technology
Machine Design Mechanism Design (3D CAD Utilization Technology for Injection Molding Analysis, Thermal Analysis, Impulse Analysis Reliability Test
Optics Geometric Optics, Surge Optics, Thin Film: Optical System Design and Estimation, Light Source Design and Optimization, Optical Instrumentation (Radiometry / Photometry), Estimation of Image Quality and Analysis, Color Engineering, Optical Thin-Film Design and Estimation
Material Element Analysis: Surface Analysis, Credibility Analysis, Chemistry Analysis
Inverter Electric Power Electronics, ANALOG Circuit Power Design: High-Frequency Power Design (DC/AC Inverter, DC/AC Converter), SMPS Technology, Light Source Drive (CCFL, EEFL, Surface Light Source, LED), Circuit Design, Power Design Technology, Transformer Design Production Technology

Digital Appliance: Required Majors
Electronics Engineering
Electrical Engineering
Computer Science
Applied Mathematics
Telecommunication Network
Mechanical Engineering
Microwave Physics
Fluid and Thermal Dynamics
Material Science
AREA JOB SPECIFICATION
Home Network Communication: PLC, Bluetooth, WLAN
Gateway: RTOS, MiddleWare (OSGL)
Server: Web, Wap, and DB
Product: Communication Interface
Modem: Programmable Logic Control (PLC) and Radio-Frequency Systems
Power Electronics
& Circuit Control Power Conversion: DC-DC Converters, Inverters, and SMPS
Motor Control: BLDCM Control, Linear Motor Control, SRM Control, Sensorless Control, and Vector Control
Motor Design and Electro-Motor Analysis: Fan Motors, BLDC Motors, SR Motors, SynRM, PM Motors, and Small Precision Motors
Software Programming: Micom, Digital Signal Processing (DSP), and ARM Processors
Sensor Application Techniques: Vision, Gas, Heat, Humidity, Pressure, and UV Sensors
Microwave Microwave Impedance Matching Optimization Technologies
Microwave Power Application Technologies
Microwave Ovens (MWO)
Fluid & Thermal Dynamics Fan Design / Analysis (Axial, Turbo, and Sirocco)
Fluid and Thermal Design for Air Conditioners and Refrigerators
Aerodynamics / Acoustics (Simulation / Experimental Analysis)
Heat Exchanger Design
Refrigeration Cycle / New Refrigerant Applications
Indoor Air Quality / Air Filtration and Purification
Compressible Fluid Dynamics Analysis for Compressors
Performance Analysis of Compressors
High Efficiency Washing Machine Design
Energy Saving (Water Saving, Cleanser Saving, and Drying)
Noise and Vibration Electric / Electronic Noise Analysis
Acoustic Field Analysis (Simulation / Experimental Analysis)
Vibration Analysis for Rotational Mechanism
Lubrication / Tribology
Structure Design/ Analysis Driving Mechanism Design, Computer-Aided Engineering (CAE), and Strength / Stress Design
Structural System Design (Refrigerators, Computers, Washing Machines, Microwave Ovens, and Vacuum Cleaners)
Environmental Engineering Wastewater Treatment and / or Recycling
Stability and Recyclability of Packaging Materials

Mechatronics Center: Required Majors
Computer Science
Electrical Engineering
Mechanical Engineering
Cybernetics
Physics
Chemistry
Metallurgical Engineering
AREA JOB SPECIFICATION
Key Component Technologies Joining Technologies (Lead-Free, Bumping, Stack Packaging, etc.)
Patterning Technologies (Circuiting, Printing, etc.)
Simulation and Layout Design (IETC1)
Speech and Pattern Recognition
Navigation and Localization
Walking Technologies (2 Leg, Dynamic Walking)
Signal Processing / Generation (Signal, Image, and Pattern)
Logic Circuit Design (Digital / Analog), Power Electronics Design
Material Selection
Optics Design, Precision Lens Design, Ultra-Precision Mechanism Development
Semiconductor Process Control (Temperature, Pressure, etc.)
Cast / Cutting
Plasma Design
Thin-Film and Wafer-Thinning Technologies
Computer-Aided Engineering (CAE)
Vibration, Heat, Fluid, Structure, and Dynamics
Measurement Software Technologies (3D, Nano)
Operational Systems (OS), Real-Time Operating Systems (RTOS), C++, Java, NET High-Level Language, Embedded Software, System Software (Windows and Linux)
Assembling Technologies
Control (Position / Velocity Control, Aligning, High-Speed Transfer, Force, Torque, Hydraulic / Pneumatics)
Handling, Inspection, and Measurement Technologies
Automated Manufacturing, Line Design, Packaging, Process Control, and Surface Mount Technologies
InkJet Control Systems, InkJet Dispensing
Graphical User Interface (GUI), Hardware (HARDWARE) Interface Technologies
Sensor Application Systems
Laser Welding, Laser Painting, etc.
Optimal Design Technologies, Scheduling / Dispatching, and Fault Detection Technologies
Data Modeling / Analysis Technologies, Database Design
Remote Control Technologies, Material Control or Monitoring Technologies
Network Technologies, Component-Oriented Programming, Computer-Integrated Manufacturing Technologies (CIM Tech), Web-Related Technologies (Inline / Cell Type Manufacturing)
Service Robot (Emotion, Intelligence, etc.)

Job Vacancies (Вакансии):
Project Leader
Technical Leader
Senior Engineer
Senior Research Engineer
Researcher
Chief Engineer
Principal Engineer
Research Engineer
Development Engineer
R&D Engineer
Technical Engineer
Project Coordinator
Electronics Engineer
Optics Engineer
Physicist
Acoustics Engineer
SW Engineer
SW Developer
Programmer
Systems Engineer
Mechanical Engineer
Production Engineer
Material Scientist
Chemist