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EPO-TEK® 301-2FL
Technical Data Sheet
For Reference Only
Low Stress, Optical Epoxy

Number of Components: Mix Ratio By W eight: Specific Gravity: Part A Part B Pot Life: Shelf Life:

Two 100:35 1.06 0.89 10 Hours One year at room temperature.

Minimum Bond Line Cure Schedule*: 80°C 3 Hours 23°C 3 Days

Note: Container(s) should be kept closed when not in use. *Please see Applications Note available on our websi te. ­IF PART A CRYSTALIZES IN STORAGE, PLACE CONTAINER IN A WARM OVEN UNTIL CRYSTALIZATION DISAPPEARS. ALLOW TO COOL TO ROOM TEMPERATURE BEFORE MIXING WITH THE PART B HARDENER *Please refer to Tech Tip #7 on our website --

Product Description: ® EPO-TEK 301-2FL is a two component optical, medical, and semiconductor grade epoxy resin. It is a more flexible version of ® EPO-TEK 301-2. EPO-TEK 301-2FL Advantages & Application Notes: Suggested for LCD optical lamination and sealing of glass plates. The product can resist yellowing over 17 days of continuous UV light exposure. Suitable for LED encapsulation. Ease of use: potting and casting, encapsulation, and adhesive. Semiconductor applications: underfill for flip chips, glob top encapsulation ov er wire bonds, spin coating at wafer level. Compliant adhesive that will be resistant to impact or vibrations. Low stress adhesive for bonding optics inside OEM / scien tific instruments. Fiber optic adhesive; bundling fibers, terminating fiber into ferrul e, adhesive for mounting optics inside fiber components, bonding glass cover slip over V-groove; spectral transmission of visible and IR light. BIOCOMPATIBLE and NON-TOXIC; complies with USP Class VI biocompatibility standards for medical devices and implantation applications. Adhesion to glass, quartz, metals, wood and most plastics is very good. May also be used for impregnating wooden or porous objects for artifact restoration. Capable of both heat cure and room temperature cure. Typical Properties: (To be used as a guide only, not as a specification. Data below is not guaranteed. Different batches, conditions and applications yield differing results; Cure condition: 80°C/3 Hours ; *denotes test on lot acceptance basis) Physical Properties: *Color: Part A: Clear/Colorless Part B: Clear/Colorless Weight Loss: *Consistency: Pourable Liquid @ 200°C: 0.50% *Viscosity (@ 100 RPM/23°C): 100 ­ 200 cPs @ 250°C: 0.96% Thixotropic Index: N/A @ 300°C: 3.52% *Glass Transition Temp.(Tg): 45°C (Dynamic Cure Operating Temp: Continuous: - 55°C to 150°C 20--200°C /ISO 25 Min; Ramp -10--200°C @ 20°C/Min) Coefficient of Thermal Expansion (CTE): Intermittent: - 55°C to 250°C -6 Below Tg: 56 x 10 in/in/°C Storage Modulus @ 23°C: 152,946 psi -6 Above Tg: 211 x 10 in/in/°C Ions: Cl 105 ppm + Shore D Hardness: 70 Na 58 ppm + Lap Shear Strength @ 23°C: > 2,000 psi NH4 8 ppm + Die Shear Strength @ 23°C: 10 Kg / 3,400 psi K 19 ppm Degradation Temp. (TGA): 325°C Particle Size: N/A Optical Properties @ 23°C: Refractive Index @ 23°C (uncured): 1.5115 @ 589 nm Spectral Transmission: > 97% @ 1000 ­ 1600 nm > 99% @ 400 ­ 1000 nm Electrical & Thermal Properties: 12 Thermal Conductivity: N/A Volume Resistivity: 0.6 x 10 Ohm-cm Dielectric Constant (1 KHz): 3.54 Dissipation Factor (1 KHz): 0.013
EPOXY TECHNOLOGY, INC. 14 Fortune Drive, Billerica, MA 01821-3972 Phone: 978.667.3805 Fax: 978.663.9782 www.EPOTEK.com Epoxies and Adhesives for Demanding ApplicationsTM This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as to its accuracy and assumes no liability in connection with any use of this product.
Rev. II Apr 2010
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